Plasma treatment is essential for wire bonding in electronics, enhancing bond strength and reliability. It cleans and modifies the surfaces of substrates and wires, removing organic contaminants and creating a hydrophilic surface. This improves adhesion, ensuring strong bonds and reducing the risk of bond failures. Plasma treatment also enhances the wettability of surfaces, facilitating better wire placement and connection, crucial for high-performance electronic devices.

Learn more about how plasma treatment is used for your specific application in the following application notes (coming soon):