With twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface cleaning and modification.
Larger, benchtop unit
Adjustable RF power settings (Low, Medium, High)
Maximum RF power of 45W
Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002
Includes a 6″ diameter x 6.5″ length Pyrex chamber
Hinged door with viewing window
Active fan cooling
Integral switch for a vacuum pump
1/8″ NPT metering valve to qualitatively control gas flow and vacuum pressure
1/8″ NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting
Weight: 37 lbs
Size: 11″ H x 18″ W x 9″ D
Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (23 L/min) and ultimate total pressure of 200 mTorr (0.27 mbar) or less
For pumping nonreactive gases (air, N2, Ar), see our Standard Vacuum Pumps.
For pumping concentrated or pure oxygen gas, see our Oxygen Service Pumps.
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