HARRICK PLASMA

Plasma Process Gases

Air

  • Contamination removal (chemical)
  • Oxidation process
  • Surface activation (wetting & adhesion)

O2

  • Contamination removal (chemical)
  • Oxidation process
  • Surface activation (wetting & adhesion)
  • Etch (organics)
  • Surface sterilization
  • Note: a special 'oxygen service' vacuum pump must be used in conjunction with O2 process gas in order to avoid risk of possible injury; inquire with Harrick Plasma for details

Ar

  • Contamination removal (ablation)
  • Surface activation (wetting & adhesion)
  • Crosslinking

H2O (water vapor)

  • Surface activation (hydroxyl groups)

N2

  • Surface activation (wetting & adhesion)

H2

  • Contamination removal (chemical)
  • Surface activation
  • Note: Extreme caution must be exercised when working with H2 process gas in order to minimize the risk of possible injury. Consult with Harrick Plasma for H2 plasma processing