HARRICK PLASMA

Plasma Process Gases

By varying the process gas, plasma processing may be used for chemical and mechanical contamination removal, oxidation, activation, crosslinking and deposition. Below are some of the most commonly used gases for plasma treatment.

Air or Oxygen (O2)

  • Contamination removal (chemical)
  • Oxidation process
  • Surface activation (wetting & adhesion)
  • Etch (organics)
  • NOTE: a special oxygen service vacuum pump must be used in conjunction with O2 gas in order to avoid risk of possible injury; inquire with Harrick Plasma for details

Argon (Ar)

  • Contamination removal (ablation)
  • Surface activation (wetting & adhesion)
  • Crosslinking

Nitrogen (N2)

  • Surface activation (wetting & adhesion)

Water Vapor (H2O)

  • Surface activation (hydroxyl groups)

Hydrogen (H2)

  • Contamination removal (chemical)
  • Surface activation
  • NOTE: Extreme caution must be exercised when working with H2 process gas in order to minimize the risk of possible injury. Consult with Harrick Plasma for H2 plasma processing