Physics of Plasma
The energy of plasma electrons and ions is sufficient to ionize neutral atoms, break molecules apart to form reactive radical species, generate excited states in atoms or molecules, and locally heat the surface. Depending on the process gases and parameters, plasmas are capable of both mechanical work, through physical ablation and high-energy ion bombardment of the surface, and chemical work, through the interaction of reactive radical species with the surface. In general, plasmas can interact with and modify a surface through the following mechanisms:
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ABLATION
Plasma ablation involves the mechanical removal of surface contaminants by energetic electron and ion bombardment. Ablation affects only the contaminant layers and the outermost molecular layers of the substrate material. Argon gas is often used for its high ablation efficiency and chemical inertness with the surface material.
CHEMICAL ETCHING
Chemical etching involves the chemical reaction of surface organic contaminants or films with highly reactive free radicals in the plasma to form volatile byproducts that are released from the sample surface. By proper selection of the gas chemistry, various types of materials can be selectively etched. while minimizing etching of other materials on the sample surface. Oxygen (O2) is commonly used to chemically etch and remove organic materials from sample surfaces.
ACTIVATION
Plasma surface activation involves the creation of surface chemical functional groups through the use of plasma gases – such as air, oxygen, and argon – which dissociate and react with the surface. In the case of polymers, plasma breaks down weak surface bonds in the polymer and replaces these surface polymer groups with chemical groups from the plasma gas, such as carbonyl, carboxyl, and hydroxyl groups. Such activation alters the surface chemistry and wettability of the surface, which can greatly enhance adhesion and bonding to other surfaces.
DEPOSITION
Plasma deposition involves the formation of a thin polymer coating on the substrate surface through polymerization of the process gas. The process gas is a mixture of a vaporized monomer and inert carrier gas to be used for plasma formation. Plasma polymerization may be applied to deposit a polymer layer with unique chemical functional groups.
CROSS-LINKING
Cross-linking is the bonding and linkage of molecular chains in a polymer. Plasma processing with inert gases can be used to cross-link polymers and produce a stronger and harder substrate microsurface. Under certain circumstances, crosslinking through plasma treatment can also lend additional wear or chemical resistance to a material.