HARRICK PLASMA

No-Flow Flux Adhesive Components

The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

Charles, Scott B., Robert J. Kinney, Michael A. Kropp, Roger A. Mader

3M Innovative Properties Company

US6528169 B2

2003-03-04

2002-03-14

2007-08-01

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